Build the “who’s who” of advanced semiconductor packaging, involve SMEs, Start-ups and Scale-ups, RTOs; map the entire supply chain from design, materials, equipment, fabs, and all the way to test and reliability; engage with MS, Regions and the specific agencies to consolidate the policies;

Study the other Chips Acts deployed in non-member countries and assess the existing European position in the global packaging world, for the most pertinent European needs and applications; aggregate the recent past similar actions at national or regional clusters level;
Engage with world leading OSATs and European stakeholders to reconsider manufacturing in Europe; assess the gaps in education and skills required for human resources geared towards advanced packaging and citizen’s awareness.

Objectives for guidance also include the Chips-packaging diplomacy, autonomy but no isolation, partnering with competencies from all over the world, vulnerability and sovereignty issues, for a decade long vision and a resilient European industrial infrastructure, making it possible to create local economic strengths, to create local jobs and to maintain and reinforce local advanced know-how and expertise in the long run while reinforcing European leadership.