Pack4EU unites
the European Semiconductor
packaging Industry
with a common roadmap

Pack4EU’s core objective is to assess the current status of packaging, assembly, and test facilities in Europe. Additionally, it aims to analyze the evolving needs of the semiconductor industry regarding advanced packaging, assembly, and test developments. The focus includes mapping existing facilities, evaluating technological capabilities, and identifying areas for improvement. Ultimately, the project seeks to inform strategic decisions aligning with the semiconductor industry’s dynamic requirements.